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Thermally Conductive Encapsulant

PAKCOOL®

    基本性能:

  • Good thermal conductivity, low thermal resistance.

  • Good flowability for fast processing and short cycle times, suitable for filling the small gaps among components and PCBs.

  • Addition-curing reaction,room-temperature curing or heating accelerating the curing and no volume varying during curing. 100% solids and no curing by-production release.

  • Non-hydrophilic, preventing the impact of moisture and dust on components.

  • Low-density type meets lightweight requirements.

  • Excellent high&low temperature resistance, weather fastness, aging resistance and electrical insulation.

  • UL94 V-0 and RoHS certified.

    应用:

  • Completely encapsulating electronic components or PCB and filling the whole space within a case or a slot for heat dissipation.

PAKCOOL® Thermally Conductive Encapsulant Specification

Product Name Color Mixing ratio Thermal conductivity
(W/m·K)
Viscosity(cP) Density
(g/cm³)
Hardness
(Shore)
File
TPC-200 colorless and transparent 1:1 - A≤3000
B≤5200
0.97 25±5(00)
TPC-213-08 white/grey 1:1 0.8 2800~5500
tunable
1.55±0.1 25±5(A)
TPC-211
High thermal conductivity & low density
white/grey 1:1 1.1 ≤4000 1.65±0.1 35±5(A)
TPC-213 white/grey 1:1 1.3 ≤6000 2.0±0.1 45±5(A)
TPC-213-UR
Ultra-soft for fibre optic discs
white/white 1:1 1.3 ≤5500 2.15±0.1 35±5(00)
TPC-215 white/grey 1:1 1.5 ≤30000 2.55±0.1 50±5(A)
TPC-219-L white/grey 1:1 1.9 ≤7000 2.69±0.1 45±5(A)
TPC-219-UR
Ultra-soft for fibre optic discs
white/grey 1:1 1.9 ≤15000 2.8±0.1 35±5(00)
TPC-225 white/grey 1:1 2.5 ≤2,5000 2.85±0.1 40±5(A)
TPC-230 white/grey 1:1 2.9 ≤32000 3.00±0.1 50±5(A)
TPC-235 white/grey 1:1 3.4 ≤50000 3.05±0.1 55±5(A)

Users can request product datasheets, SDS, and samples for trial by phone or e-mail.


Packaging specifications for PAKCOOL® Thermally Conductive Encapsulant

     The PAKCOOL® TPC-2xx series two-part Thermally Conductive Encapsulant is offered in various packaging options: 50 g, 1 kg cans, 5 kg plastic pails, and 20 kg plastic pails. Parts A and B are packed in differently colored pails to prevent mixing errors.

Operating Guide for PAKCOOL® Thermally Conductive Encapsulant

Application process
1. Dispersion:
         Before use, parts A and B must be thoroughly mixed within their original packaging. This is crucial as settling can occur over time; however, thorough mixing will not impact performance. It is advisable to use electric mixing equipment for this process. The mixing equipment and the mixing rods used should be strictly segregated for parts A and B to prevent contact and unintended curing.

2. Measurement:
         The parts A and B should be measured accurately in a 1:1 ratio. An allowable margin of error is ±10%. Deviating beyond this range can result in the cured compound being either too hard or too soft. Excessive deviation may lead to the compound not curing properly. When using an automatic dispensing machine, it is essential to constantly monitor the balance of parts A and B in the storage barrels, check for any significant color differences in the mixed compound, verify if the silicone has cured post-mixing, and ensure the consistency in hardness after curing. These observations can help determine if the dispensing system is functioning correctly.

3. Mixing:
          Measure the silicone in a 1:1 ratio and mix thoroughly in a container. For manual mixing, use a spatula to scrape the sides and bottom of the container to ensure there are no unmixed areas or missed spots. The silicone should have a uniform color once thoroughly mixed. If possible, the mixed compound can be vacuum degassed by applying a vacuum of 10-20 mmHg for 5 minutes or until no bubbles emerge. The thoroughly mixed compound should then be poured into the product to be potted within the specified working time. When using an automatic dispensing machine, if feasible, vacuum degas the silicone in the storage tank (mixing while degassing can enhance the effect), before dispensing.

4. Curing:
          Place the potted product to cure at room temperature (23°C-25°C). It can proceed to the next step after initial curing, with full curing requiring 8 to 24 hours. The curing process accelerates in higher summer temperatures and slows down in lower winter temperatures. The curing time decreases as the temperature increases (refer to the table below for details):
Temperature Cure time
70°C 40 min
100°C 25 min
Precautions

1. Since there is a slight difference in viscosity between parts A and B, if using machinery for potting, the pressure on part B may need to be slightly adjusted.
2. his product may not cure or may only partially cure when in contact with certain substances. These include compounds containing sulfur, phosphorus, or nitrogen such as polysulfone, polythioether, polyurethane, substances containing amides or amines, materials containing elements like tin, arsenic, antimony, selenium, tellurium, some unsaturated hydrocarbons, and plasticizers. It is advised that operators who smoke should wash their hands with soap before handling this product, as smoking can leave sulfur residues on the hands.
3. During use, the product's viscosity may fluctuate slightly, but this will not affect its performance.


Typical Applications of PAKCOOL® Thermally Conductive Encapsulant


TPC-200 is used for optical discs.             TPC-215 is used for power battery vehicle chargers.        TPC-213-08 is used for LED bulb drivers.

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