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Thermally Conductive Encapsulant

PAKCOOL®

    基本性能:

  • Good thermal conductivity, low thermal resistance.

  • Good flowability for fast processing and short cycle times, suitable for filling the small gaps among components and PCBs.

  • Addition-curing reaction,room-temperature curing or heating accelerating the curing and no volume varying during curing. 100% solids and no curing by-production release.

  • Non-hydrophilic, preventing the impact of moisture and dust on components.

  • Low-density type meets lightweight requirements.

  • Excellent high&low temperature resistance, weather fastness, aging resistance and electrical insulation.

  • UL94 V-0 and RoHS certified.

    应用:

  • Completely encapsulating electronic components or PCB and filling the whole space within a case or a slot for heat dissipation.

PAKCOOL® Thermally Conductive Encapsulant Specification

Product Name Color Mixing ratio Thermal conductivity
(W/m·K)
Viscosity(cP) Density
(g/cm³)
Hardness
(Shore)
File
TPC-200 colorless and transparent 1:1 - A≤3000
B≤5200
0.97 25±5(00) TPC-200
TPC-213-08 white/grey 1:1 0.8 ≤5500 1.60±0.10 25±5(A) TPC-213-08
TPC-213-10 white/grey 1:1 1.0 ≤4000 1.65±0.10 45±5(A) TPC-213-10
TPC-213 white/grey 1:1 1.3 ≤6500 2.20±0.10 45±5(A) TPC-213
TPC-213-UR
Ultra-soft for fibre optic discs
white/white 1:1 1.3 ≤5500 2.15±0.10 35±5(00) TPC-213-UR
TPC-215 white/grey 1:1 1.5 ≤30000 2.55±0.10 50±5(A) TPC-215
TPC-219-L white/grey 1:1 1.9 ≤7000 2.69±0.10 45±5(A) TPC-219-L
TPC-219-UR
Ultra-soft for fibre optic discs
white/grey 1:1 1.9 ≤15000 2.80±0.10 35±5(00) TPC-219-UR
TPC-225 white/grey 1:1 2.5 ≤25000 2.85±0.10 40±5(A) TPC-225
TPC-230 white/grey 1:1 2.9 ≤32000 3.00±0.10 50±5(A) TPC-230
TPC-235 white/grey 1:1 3.4 ≤50000 3.05±0.10 55±5(A) TPC-235

Users can request product datasheets, SDS, and samples for trial by phone or e-mail.



Packaging specifications for PAKCOOL® Thermally Conductive Encapsulant

     The PAKCOOL® TPC-2xx series two-part Thermally Conductive Encapsulant is offered in various packaging options: 50 g, 1 kg cans, 5 kg plastic pails, and 20 kg plastic pails. Parts A and B are packed in differently colored pails to prevent mixing errors.

Operating Guide for PAKCOOL® Thermally Conductive Encapsulant

Operation guide

1. Engineer should scrape the bottom and wall and stir A-part and B-part separately in their own barrels thoroughtly, the stiring time should not less than 60s.

2. Mix equal weight or volume of  A-part and B-part  together in one container, and stir the mixed glue thoroughtly until the color become even gray, the blending time should not less than 60s

3. Then let the glue stand for some time to allow the bubbles to escape naturally. If possible, the mixed compound can be vacuum degassed by applying a vacuum of 10-20 mmHg for 5 minutes or until no bubbles emerge. 

4.  Finally, pour the glue into the product to be potted within the specified working time and let the potted products in room temperature for curing. Complete curing needs 8 to 24 hours. The curing process accelerates in higher summer temperatures and slows down in lower winter temperatures. The curing time decreases as the temperature increases (refer to the table below for details):

Temperature Cure time
70°C 40 min
100°C 25 min
Precautions

1. Since there is a slight difference in viscosity between parts A and B, if using machinery for potting, the pressure on part B may need to be slightly adjusted.
2. his product may not cure or may only partially cure when in contact with certain substances. These include compounds containing sulfur, phosphorus, or nitrogen such as polysulfone, polythioether, polyurethane, substances containing amides or amines, materials containing elements like tin, arsenic, antimony, selenium, tellurium, some unsaturated hydrocarbons, and plasticizers. It is advised that operators who smoke should wash their hands with soap before handling this product, as smoking can leave sulfur residues on the hands.
3. During use, the product's viscosity may fluctuate slightly, but this will not affect its performance.


PAKCOOL® TPC-200 Two-part High-Transparency Encapsulant for Fiber Lasers

    PAKCOOL® TPC-200 is a two-part transparent potting material which cures at room temperature or heating can accelerate the curing. TPC-200 has lower viscosity and can fill in the tiny gaps among fibers and heatsink. After curing, TPC-200 exhibits excellent optical transparency, high and low temperatures resistance and electrical insulation. The cured material has low hardness and exerts low stress to components or fibers due to temperature variations during operation, very suitable for encapsulating and fixing fibers on the water-cooling plate. TPC-200 is non-hydrophilic and moisture-proof, which can effectively reduce the impact of humidity on fibers and extend fibers’ lifespan


PAKCOOL® Two-part Thermally Conductive Encapsulant TPC-213-UR for Heat Dissipation and Moisture Protection in Fiber Laser Systems

      Chooyu's PAKCOOL® TPC-213-UR/TPC-219-UR are specially designed two-part potting material with thermal conductivity of 1.3W/m▪K/1.9w/m*K, both parts are white color. TPC-213-UR/TPC-219-UR cures at room temperature and heating can accelerate the curing. Upon curing, a gel-like thermally conductive elastomer is formed with minimal stress to electronic components or fibers, very suitable for encapsulating and fixing fibers on the water-cooling plate and promoting the heat dissipation from fiber to the cooling plate. TPC-213-UR/TPC-219-UR are non-hydrophilic and moisture-proof, which can effectively reduce the impact of humidity on fibers and extend fibers’ lifespan.


Typical Applications of PAKCOOL® Thermally Conductive Encapsulant






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