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Thermally Conductive Silicone Gap Filler

PAKCOOL®

    基本性能:

  • Good thermal conductivity, low thermal resistance.

  • Addition-curing reaction, no volume varying during curing.

  • Good thixotropy. Can fill in gaps with different thicknesses under low pressure.

  • Room-temperature curing or heating accelerating the curing, 100% solids and no curing by-production release.

  • Excellent high&low temperature resistance, weather fastness, aging resistance and electrical insulation.

  • Excellent chemical and mechanical stability.

  • UL94 V-0 and RoHS certified.

    应用:

  • Used for filling in gaps with different thicknesses and irregular shape. Curing at room temperature or rapidly with heating.

PAKCOOL® One-part Thermally Conductive Silicone Gap Filler (Heat curing) Specification

Product Name Thermal conductivity(W/m·K) Viscosity(cP) Density(g/cm³) Cure time(min) Hardness(Shore 00) File
TC-9110-T 1.0 950,000±350,000 2.60±0.20 80@120℃ 35±25
TC-9120-T 2.0 1,125,000±375,000 2.80±0.20 80@120℃ 35±25
TC-9130-T 3.0 1,125,000±375,000 3.10±0.20 80@120℃ 35±25
TC-9135-T 3.5 1,100,000±350,000 3.20±0.30 80@120℃ 35±25
TC-9140-T 4.0 2,000,000±1,000,000 3.20±0.30 80@120℃ 35±25
TC-9150-T 5.0 2,500,000±1,000,000 3.40±0.30 80@120℃ 40±30

            PAKCOOL® TC-91xx-T series one-part thermally conductive silicone gap filler, also considered as a heat-curing thermal gel, perfectly combines high thermal conductivity with low thermal resistance. Before curing, it is a squeezable paste with excellent thixotropy, suitable for manual or automated dispensing operations. It cures quickly at temperatures ranging from 80°C to 150°C into an adhesive gel, filling the gap between the heating device and the heat sink and adhering to their contact surfaces, achieving lower contact thermal resistance than ultra-soft thermal pads. The cured gel maintains a certain thickness without collapsing and is completely non-oiling, with excellent aging resistance and stability. This product should be used promptly at room temperature. It requires heating for use and cures into a soft gel at high temperatures with low adhesive strength, necessitating the use of fasteners. We currently offer a one-part heat-curing thermal gel with thermal conductivity ranging from 1.0 to 5.0 W/m·K. The product is as easy to apply as an ultra-soft pad, allowing customers to conveniently adjust the amount and path of dispensing according to their application. The cured gel is tacky but lacks bonding strength, facilitating easy removal and replacement.



PAKCOOL® Two-part Thermally Conductive Silicone Gap Filler (Room temperature curing) Specification


Product Name Mixing ratio Thermal conductivity(W/m·K) Viscosity(cP) Density(g/cm³) Hardness(Shore) File
TC-215 1:1 1.5 1,500,000±400,000 2.62±0.10 45±5(A)
TC-215-AD 1:1 1.5 1,500,000±400,000 2.62±0.10 55±5(A)
TC-219 1:1 1.9 1,600,000±400,000 2.75±0.10 40±5(A)
TC-219-AD 1:1 1.9 1,600,000±400,000 2.75±0.10 55±5(A)
TC-230 1:1 3.0 1,600,000±400,000 2.86±0.10 45±5(A)
TC-235-T 1:1 3.5 650,000±250,000 2.95±0.10 50±10(00)
TC-240 1:1 4.0 350,000±100,000 3.20±0.10 50±10(00)
TC-250 1:1 5.0 650,000±250,000 3.30±0.10 50±10(00)


        PAKCOOL® TC-200 series features dual-component thermal silicone gels that cure at room temperature into solid elastomers, commonly used as gap fillers. These products are ideal for filling the thermal gaps on PCBs and the irregular gaps between the components and their surrounding casings or heat sinks. The TC-2xx-AD variant in this series offers an enhanced adhesive formulation that delivers both thermal conductivity and bonding capabilities across various materials. The thermal conductivity of our dual-component silicone gels ranges from 1.5 to 5.0 W/m·K, facilitating efficient heat management. These products are designed for ease of extrusion and handling. Options like TC-235-T, TC-240, and TC-250 present low hardness and low adhesive strength post-curing, functioning similarly to two-component, room-temperature curing thermal gels or ultra-soft dispensable pads. Once cured, the gel is non-tacky, making it easy to remove and replace. The PAKCOOL® TC-200 series ensures 100% curing at room temperature without any gas emissions, and the curing process can be accelerated by heating to improve production efficiency. For more detailed information and to request samples, please contact us.


Packaging Specifications for PAKCOOL® One-part Thermally Conductive Silicone Gap Filler (Heat curing)

     PAKCOOL®TG-91xx-T series One-part Thermally Conductive Silicone Gap Filler (Heat curing) is offered in various packaging options: 30mL, 55mL, 330mL tube or customizable according to customer requirements.


Operating Guide for PAKCOOL® One-part Thermally Conductive Silicone Gap Filler (Heat curing)

Application Process
1. Preparation and Storage:
         

The series is comprised of one-part, heat-curing products that can be stored flat at room temperature for six months, currently available only in cartridge form suitable for automatic or manual dispensing. The smallest packaging offered is 30mL, with options available in 55mL, 330mL, and other specifications.

2. Application Method and Process:
         

The thermally conductive gap filler is used between heating elements and heat sinks, and it is designed to fill gaps. Since it remains very soft after curing, facilitating disassembly, a fastening device is generally still required. Before dispensing, ensure that both interfaces are free from impurities and dust, which could affect thermal and adhesive performance; surfaces can be cleaned with alcohol. When applying, keep air or piston pressure ≤0.6MPa, and control the dispensed amount based on set parameters such as dispensing pressure and time. The amount of adhesive should be 1 to 1.5 times the theoretical value calculated from the contact surface size, gap thickness, and adhesive density. The thinner the application, the better the thermal transfer. After application, press the cooling surface (or heating surface) against the adhesive to ensure all bonding surfaces contact the adhesive; any excess can be scraped off.

The product needs to be cured at 150°C for 0.5 to 1 hour after assembly, with longer times required at lower temperatures; it is recommended not to go below 100°C, maintaining the temperature for at least 3 hours.

3. Unused Product:
          For any unused cartridge products, it is recommended to remove them from the dispensing machine and tighten the outlet cap for storage. If the cartridge must remain in the dispensing machine, relieve any air pressure or piston pressure after removal.
Precautions
  • This product may not cure or may only partially cure when in contact with certain substances. These include compounds containing sulfur, phosphorus, or nitrogen such as polysulfone, polythioether, polyurethane, substances containing amides or amines, as well as materials containing elements like tin, arsenic, antimony, selenium, and tellurium. Additionally, some unsaturated hydrocarbons and plasticizers may also inhibit the curing process.


Packaging Specifications for PAKCOOL® Two-part Thermally Conductive Silicone Gap Filler (Room temperature curing)

     PAKCOOL®TC-2xx series Two-part Thermally Conductive Silicone Gap Filler (Room temperature curing) is offered in various packaging options: 50mL, 200mL, 400mL tube, 20Kg and 40Kg barrel or customizable according to customer requirements.


Operating Guide for PAKCOOL® Two-part Thermally Conductive Silicone Gap Filler (Room temperature curing)

Application Process


 50mL Manual Dispensing Assembly

First, push the safety latch (A) upwards, then insert the plunger rod (B) into the dispensing gun so that its advancing teeth face downward. Load the dual-component adhesive tube (C) into the slot at the front end of the dispensing gun, flip the slot upwards, and lock it at the top end (D) of the gun. Turn the cap of the adhesive tube a quarter turn counterclockwise to remove it, then attach the static mixer (E) by turning it a quarter turn clockwise at the front end of the tube. Before use, either cut a suitable size outlet hole in the end of the static mixer or attach a needle to the Luer® connector. After use, detach the mixer and securely replace the cap on the adhesive tube.

200mL and 400mL Dispensing Assembly

Apart from using a pneumatic dispensing system, the usage is similar to the 50mL manual dispensing assembly. Remove the plunger rod from the dispensing gun. Set the air pressure of the pneumatic dispenser between 60 and 90 psi, and install the dual-component adhesive tube at the end of the pneumatic dispensing machine. Turn the cap of the adhesive tube a quarter turn counterclockwise to remove it, then attach the static mixer by turning it a quarter turn clockwise at the front end of the tube. Before use, either cut a suitable size outlet hole in the end of the static mixer or attach a needle to the Luer® connector. After use, remove the mixer and securely replace the cap on the adhesive tube.

       If packaged in cartridges, measure and mix components A and B in a 1:1 ratio (by volume or weight) in a clean container. After thorough mixing, degas the mixture under a vacuum of 73.5 mmHg for 5 minutes before using it as a thermal interface material or potting compound. This preparation ensures optimal performance of the material in thermal management applications.

If the product is stored frozen, it must be warmed to room temperature conditions before use (warming time > 4 hours). Then, attach a mixing tube (with no fewer than 17 segments) and place it in a manual or pneumatic dispensing gun or device. The initial 2-3 grams of the dispensed product may not be uniformly mixed and should not be used. After dispensing, allow the product to cure at room temperature (23°C-25°C). It can proceed to the next step after initial curing, with full curing requiring 12-48 hours. The curing process accelerates in higher summer temperatures and slows down in lower winter temperatures. The curing time decreases as the temperature increases (refer to the table below for details):


Temperature Cure time
70°C 40 min
150°C 15 min
Precautions
  • 1. Due to slight differences in viscosity between parts A and B, if using a dispensing machine, slight adjustments to the pressures of the two components may be necessary.
  • 2. The two-part thermally conductive silicone gap filler may not cure or may only partially cure when in contact with certain substances, including compounds containing sulfur, phosphorus, nitrogen, water, and organic salts. It is recommended that operators who smoke wash their hands with soap before handling the product, as smoking can leave sulfur residues on the hands.
  • 3. Please store the product in a sealed container. Once mixed, the adhesive should be used completely to avoid waste.



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