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Thermally Conductive Adhesive

PAKCOOL®

    基本性能:

  • Good thermal conductivity, low thermal resistance.

  • No primer required, strong adhesion, suitable for a wide range of applications.

  • Moisture-cure type, curing at room temperature, easy to use.

  • Heat-cure type, cures quickly at high temperature, suitable for reflow soldering.

  • Excellent high and low temperature resistance, weather fastness, aging resistance and electrical insulation.

  • Excellent chemical and mechanical stability.

  • UL94 V-0 and RoHS certified.

    应用:

  • One-part Moisture-cure Thermally Conductive RTV Silicone Adhesive products are used to bond heat source device and heat sink together and conduct heat between. No fixture needed and ease to use. Ambient moisture may affect the curing time.
    One-part Heat Cure Thermally Conductive Adhesive products application for bonding between heat source and heat sink with large contacting surfaces, suitable for heat curing occasions, such as reflow soldering.

PAKCOOL® One-part Moisture-cure Thermally Conductive RTV Silicone Adhesive Specification

Product Name Color Thermal conductivity(W/m·K) Viscosity(cP) Tack free time(min) Density(g/cm³) Hardness
(Shore A)
Shear strength(MPa) File
TC-100 white 0.75 non-flowable, paste 3 1.59±0.10 56 1.8 TC-100
TC-110 white 1.3 non-flowable, paste 5 2.28±0.10 76 2.6 TC-110
TC-115 white 1.5 non-leveling 4 2.60±0.10 76 2.2 TC-115
TC-120 white 2.0 non-leveling 4 2.81±0.15 81 2.7 TC-120
TC-125 white 2.5 non-leveling 5 2.96±0.15 82 3.0 TC-125
TC-130 white 3.0 non-flowable, paste 2 2.96±0.15 83 1.9 TC-130
TC-135 white 3.5 non-flowable, paste 2 3.13±0.15 89 1.8 TC-135
TC-140 white 4.2 non-flowable, paste 3 3.17±0.15 90 2.2
TC-140

PAKCOOL® One-part Heat-cure Thermally Conductive Adhesive Specification

Product Name Thermal conductivity(W/m·K) Viscosity(cP) Density(g/cm³) Cure time(min) Hardness
(Shore A)
Shear strength(MPa) File
TC-9100 - 440,000 1.60±0.20 10@150℃ 55±15 2.3 TC-9100
TC-9110 1.0 80,000 2.50±0.20 10@150°C 80 5.3 TC-9110
TC-9115 1.5 110,000±50,000 2.60±0.10 60@150°C 72.5±12.5 2.6 TC-9115
TC-9118 1.8 100,000±30,000 3.00±0.20 20@150°C ≥80 4.8 TC-9118
TC-9120 1.8 750,000±200,000 2.70±0.15 30@150°C 70±10 1.1 TC-9120
TC-9130 3.0 84,000 3.15±0.20 10@150°C 93 5.6 TC-9130
TC-9140 4.0 300,000 3.40±0.30 10@150℃ 91 5.1 TC-9140


Packaging Specifications for PAKCOOL® One-part Moisture-cure Thermally Conductive RTV Silicone Adhesive

     PAKCOOL®TC-1xx series One-part Moisture-cure Thermally Conductive RTV Silicone Adhesive is offered in various packaging options: 330mL cartridge packaging or customizable according to customer requirements.

Operating Guide for PAKCOOL® One-part Moisture-cure Thermally Conductive RTV Silicone Adhesive

Application Process
1. Surface Cleaning:
          Clean the surface of the object where the adhesive will be applied, removing any oil, dirt, or impurities.
2. Application of Adhesive:
          Cut a small opening at the tip of the adhesive cartridge, insert it into a caulking gun, and apply the adhesive to the cleaned surface.
3. Curing:
         After applying the adhesive, quickly join the bonding surfaces together and expose the assembled parts to air. The curing time depends on environmental humidity/temperature and the depth of the adhesive layer. It is recommended that the adhesive depth does not exceed 5mm. The surface will dry and fully cure in approximately 7 days.
Precautions
  • 1. Ventilation: It is recommended to use the product in well-ventilated areas to minimize odors.
  • 2. Usage: Try to use the entire contents after opening. If not used up in one go, remove any cured part before subsequent use.
  • 3. Safety Information: Please refer to the product's Material Safety Data Sheet (MSDS) for safety details.


Packaging Specifications for PAKCOOL® One-part Heat Cure Thermally Conductive Adhesive

     PAKCOOL®TG-91xx series One-part Heat Cure Thermally Conductive Adhesive is offered in various packaging options: 30mL and 55mL dispensing syringes, 330mL cartridge packaging, or customizable according to customer requirements.

Operating Guide for PAKCOOL® One-part Heat Cure Thermally Conductive Adhesive

Application Process

1. Preparation and Storage:
         This 1-part heat-curing product should be stored in horizontal at <0°C immediately upon receipt. Before use, the product should be left at room temperature (about 25°C) for at least 2 hours to warm up. Once warmed, the product can be installed in a dispensing machine for normal use. The warmed up product is suggested to be used up within 3 days at around 25°C, not exceeding 5 days. 

2. Application Method and Process:
         When dispensing, keep air pressure or piston pressure ≤0.6 MPa and control the amount of adhesive dispensed onto the heating (or cooling) surface by setting the dispensing pressure and time parameters. 

          This product series is suitable for reflow soldering processes, achieving optimal curing and bonding at about 150°C for 10 minutes. After reflow soldering, baking at 150°C for some time can enhance the bonding. Some products may require curing at 150°C for 30 minutes. The curing time extends at lower curing temperatures and the curing temperature is recommended not below 100°C, with a minimum curing time of 2 hours.
3. Unused Product:
          Unused cartridge products are recommended to remove them from the dispensing machine and tighten the outlet cap for storage. For cartridge not used within 2 days, store in a freezer . Product should be used promptly after warming.

Precautions


  • 1. Immediate Storage: Upon receipt, the product should be stored in a freezer immediately. Before use, allow the product to warm to operating temperature.
  • 2. Viscosity and Storage: The viscosity of the product will increase over time during storage. Store at low temperatures and use as quickly as possible to avoid operational difficulties due to changes in viscosity.
  • 3. Compatibility: This product may not cure or may only partially cure when in contact with certain substances. These substances include compounds containing sulfur, phosphorus, or nitrogen such as polysulfone, polythioether, polyurethane, materials containing amides or amines, and substances with tin, arsenic, antimony, selenium, tellurium, some unsaturated hydrocarbons, and plasticizers.


Use PAKCOOL® TC-9110/9120/9140 in Planer Transformer and Ultra Thin Power Modules

       Chooyu's PAKCOOL® TC-9100 series production are high-performance One-part Heat Cure Thermally Conductive Adhesive with thermal conductivity from 1.0 W/m·K to 4.0W/m*K (ASTM D5470). TC-9100 series products have good adhesion to various materials such as copper, aluminum, stainless steel, and PCBs. Curing without the release of by-products, it can be used in large areas, deep areas, and completely enclosed situations. The TC-9100 series products can be used for bonding magnetic cores and PCBs in planar transformers, as well as for bonding magnetic cores and PCBs in high-power ultra thin power modules. After heated in 150°C for 10 minutes, TC-9140 can have hardness of 90 (ShoreA) and adhesive strength up to 5MPa.




Application of PAKCOOL® TC-9110 on Concentrated Photovoltaic Power Modules

       Chooyu's PAKCOOL® TC-9110 is a high-performance One-part Heat Cure Thermally Conductive Adhesive with a thermal conductivity of 1.0 W/m·K (ASTM D5470). Once fully cured, the adhesive strength exceeds 3 MPa, requiring heating to cure. This product is designed for stability and can operate long-term within a temperature range of -50°C to 200°C, maintaining consistent adhesive and thermal properties. It is ideal for use in High Concentration Photovoltaic (HCPV) cell modules, applicable either under the photovoltaic conversion module or directly on the backplate to bond the module to the back. Curing occurs within about 10 minutes at 150°C. Thanks to its excellent thermal conductivity, TC-9110 can transfer heat generated by sunlight exposure from the bottom of the module to the backplate, where it is dissipated into the air or removed by a cooling system attached to the backplate. The TC-9100 series products from Chooyu offer thermal conductivity ranging from 1.0 W/m·K to 4 W/m·K. Samples are available upon request for trial purposes.




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