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Thermally Conductive Adhesive

PAKCOOL®

    基本性能:

  • Good thermal conductivity, low thermal resistance.

  • No primer required, strong adhesion, suitable for a wide range of applications.

  • Moisture-cure type, curing at room temperature, easy to use.

  • Heat-cure type, cures quickly at high temperature, suitable for reflow soldering.

  • Excellent high and low temperature resistance, weather fastness, aging resistance and electrical insulation.

  • Excellent chemical and mechanical stability.

  • UL94 V-0 and RoHS certified.

    应用:

  • One-part Moisture-cure Thermally Conductive RTV Silicone Adhesive products are used to bond heat source device and heat sink together and conduct heat between. No fixture needed and ease to use. Ambient moisture may affect the curing time.
    One-part Heat Cure Thermally Conductive Adhesive products application for bonding between heat source and heat sink with large contacting surfaces, suitable for heat curing occasions, such as reflow soldering.

PAKCOOL® One-part Moisture-cure Thermally Conductive RTV Silicone Adhesive Specification

Product Name Color Thermal conductivity(W/m·K) Viscosity(cP) Tack free time(min) Density(g/cm³) Hardness
(Shore A)
Shear strength(MPa) File
TC-100 white 0.75 illiquid, paste 3 1.59±0.10 56 1.8 TC-100
TC-110 white 1.3 illiquid, paste 5 2.28±0.10 76 2.6 TC-110
TC-110-H white 1.1 illiquid,
brushed but not dripping
3 2.61±0.10 76 2.45 TC-110-H
TC-115 white 1.5 no leveling 4 2.60±0.10 76 2.2 TC-115
TC-120 white 2.0 no leveling 4 2.81±0.15 81 2.7 TC-120
TC-125 white 2.5 no leveling 5 2.96±0.15 82 3.0 TC-125
TC-130 white 3.0 illiquid, paste 2 2.96±0.15 83 1.9 TC-130
TC-135 white 3.5 illiquid, paste 2 3.13±0.15 89 1.8 TC-135
TC-140 white 4.2 illiquid, paste 3 3.17±0.15 90 2.2 TC-140

PAKCOOL® One-part Heat-cure Thermally Conductive Adhesive Specification

Product Name Thermal conductivity(W/m·K) Viscosity(cP) Density(g/cm³) Cure time(min) Hardness
(Shore A)
Shear strength(MPa) File
TC-9110 1.0 130,000±40,000 2.35±0.15 80@120°C 80±10 3.0
TC-9115 1.5 110,000±50,000 2.60±0.10 80@120°C 72.5±12.5 2.6
TC-9118 1.8 120,000±30,000 2.75±0.15 80@120°C 80±10 2.0
TC-9120 1.8 750,000±200,000 2.70±0.15 80@120°C 70±10 1.1
TC-9130 3.0 1,125,000±375,000 3.20±0.20 80@120°C 85±10 2.5


Packaging Specifications for PAKCOOL® One-part Moisture-cure Thermally Conductive RTV Silicone Adhesive

     PAKCOOL®TC-1xx series One-part Moisture-cure Thermally Conductive RTV Silicone Adhesive is offered in various packaging options: 330mL cartridge packaging or customizable according to customer requirements.

Operating Guide for PAKCOOL® One-part Moisture-cure Thermally Conductive RTV Silicone Adhesive

Application Process
1. Surface Cleaning:
          Clean the surface of the object where the adhesive will be applied, removing any oil, dirt, or impurities.
2. Application of Adhesive:
          Cut a small opening at the tip of the adhesive cartridge, insert it into a caulking gun, and apply the adhesive to the cleaned surface.
3. Curing:
         After applying the adhesive, quickly join the bonding surfaces together and expose the assembled parts to air. The curing time depends on environmental humidity/temperature and the depth of the adhesive layer. It is recommended that the adhesive depth does not exceed 5mm. The surface will dry and fully cure in approximately 7 days.
Precautions
  • 1. Ventilation: It is recommended to use the product in well-ventilated areas to minimize odors.
  • 2. Usage: Try to use the entire contents after opening. If not used up in one go, remove any cured part before subsequent use.
  • 3. Safety Information: Please refer to the product's Material Safety Data Sheet (MSDS) for safety details.

  • Packaging Specifications for PAKCOOL® One-part Heat Cure Thermally Conductive Adhesive

         PAKCOOL®TG-91xx series One-part Heat Cure Thermally Conductive Adhesive is offered in various packaging options: 30mL and 55mL dispensing syringes, 330mL cartridge packaging, or customizable according to customer requirements.

    Operating Guide for PAKCOOL® One-part Heat Cure Thermally Conductive Adhesive

    Application Process

    1. Preparation and Storage:
             This series is a single-component, heat-curable product. Store flat at <0°C for 3 months or at 20°C for 20 days. Currently, only sealed packaging is provided. Ice packs may be included in the packaging during shipment to maintain low temperatures. Upon receipt, customers should store the product in a freezer immediately. Before use, allow the product to return to room temperature for at least 2 hours at 25°C; adjust the warming time based on the quantity and capacity of the product. A convection oven with airflow is recommended for even warming. Once warmed, the product can be installed in a dispensing machine for normal use. After warming, use the product as soon as possible, as its viscosity increases with time, especially above 20°C. It is recommended to use up the product within 3 days at around 25°C, ideally not exceeding 5 days. The smallest packaging available is 30mL.

    2. Application Method and Process:
             The thermal adhesive should be applied between the heating element and the heat sink and will also act as an adhesive. Generally, no additional securing device is needed depending on the size of the device. Before dispensing, check the interfaces for impurities or dust, which can be cleaned with alcohol to avoid affecting thermal conductivity and adhesion. When using, keep air pressure or piston pressure ≤0.6 MPa. Control the amount of adhesive dispensed onto the heating (or cooling) surface by setting the dispensing pressure and time parameters. The amount of adhesive should be 1 to 1.5 times the theoretical value calculated based on the contact surface size, gap thickness, and adhesive density. The thinner the layer of adhesive, the better the thermal conductivity and adhesion. Then press the cooling surface (or heating surface) against the adhesive to ensure full contact.

              This product series is suitable for reflow soldering processes, achieving optimal curing and bonding at about 150°C for 10 minutes. After reflow soldering, the adhesive is fully cured, and baking can be performed as needed for enhanced bonding. Some products may require curing at 150°C for 30 minutes. The curing time extends with lower temperatures; it is recommended not to go below 100°C, with a minimum curing time of 2 hours.
    3. Unused Product:
              For any unused cartridge products, it is recommended to remove them from the dispensing machine and tighten the outlet cap for storage. If it is necessary to store the cartridge in the dispensing machine, remove any air pressure or piston pressure after removing the cartridge. Use as soon as possible at room temperature following the instructions above. If not used within 2 days, store in a freezer and use promptly after warming.

    Precautions


    • 1. Immediate Storage: Upon receipt, the product should be stored in a freezer immediately. Before use, allow the product to warm to operating temperature.
    • 2. Viscosity and Storage: The viscosity of the product will increase over time during storage. Store at low temperatures and use as quickly as possible to avoid operational difficulties due to changes in viscosity.
    • 3. Compatibility: This product may not cure or may only partially cure when in contact with certain substances. These substances include compounds containing sulfur, phosphorus, or nitrogen such as polysulfone, polythioether, polyurethane, materials containing amides or amines, and substances with tin, arsenic, antimony, selenium, tellurium, some unsaturated hydrocarbons, and plasticizers.

    Application of PAKCOOL® TC-9110 on Concentrated Photovoltaic Power Modules



             Chooyu's PAKCOOL® TC-9110 is a high-performance One-part Heat Cure Thermally Conductive Adhesive with a thermal conductivity of 1.0 W/m·K (ASTM D5470). Once fully cured, the adhesive strength exceeds 3 MPa, requiring heating to cure. This product is designed for stability and can operate long-term within a temperature range of -50°C to 200°C, maintaining consistent adhesive and thermal properties. It is ideal for use in High Concentration Photovoltaic (HCPV) cell modules, applicable either under the photovoltaic conversion module or directly on the backplate to bond the module to the back. Curing occurs within about 10 minutes at 150°C. Thanks to its excellent thermal conductivity, TC-9110 can transfer heat generated by sunlight exposure from the bottom of the module to the backplate, where it is dissipated into the air or removed by a cooling system attached to the backplate. The TC-9100 series products from Chooyu offer thermal conductivity ranging from 1.0 W/m·K to 3 W/m·K. Samples are available upon request for trial purposes.


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