PAKCOOL® TPC-245 is a two components high thermal conductive liquid electronic encapsulation material. The glue is crosslinked at room temperature, and heating can accelerate the crosslinking speed. Besides, it has high thermal conductive, and low viscosity, good fluidity, and easy foaming, low thermal expansion rate as well as high insulation performance. Thus can improve the service life of electronic components. This series of products are also widely used for bonding and heating electronic devices, heat sinks, or metal shells. After curing, it will not detach from the protective shell during alternating use of cold and hot temperature. The sealing surface is smooth and free from volatile matter generation.