The newly launched PAKCOOL^® TP-280 is a silicone-based thermal insulation pad with a thermal conductivity of 8.0 W/m▪K, designed for high-heat-density processors such as those in 5G communication devices and network processors. This product effectively dissipates heat to water cooling plates, ensuring that processors operate within a safe temperature range.

    PAKCOOL^® TP-280 thermal pads successfully integrate high thermal conductivity, softness, and elasticity. This product line offers a wide range of thermal conductivities to suit various applications. As an electrically insulating material, it efficiently fills gaps between heat sources and heat sinks even under low pressure, ensuring excellent thermal transfer. The product performs optimally under a pressure range of 20-100 psi (0.14-0.69 MPa) and can be customized to specific dimensions based on customer requirements.

    The pads feature inherent tackiness, eliminating the need for additional adhesives that could affect thermal performance, thereby facilitating large-scale production. Both sides of the pads are covered with easy-to-peel dust protection films.