Thermally Conductive Phase Change Material-卓尤

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Thermally Conductive Phase Change Material

PAKCOOL®

基本性能:

Excellent Thermal Conductivity – Thermal conductivity 3.0 W/m·K, effectively reducing interfacial thermal resistance.
Intelligent Phase-Change Compliance – Softens automatically at around 40–50 °C to fully fill micro-gaps between heat source and heatsink.
Excellent Interfacial Wettability – After phase change, the surface becomes tacky, ensuring intimate contact with both thermal surfaces.
Long-Term Reliability – Excellent resistance to pump-out, high & low temperature, and humidity aging.
Electrical Insulation & Safety – Electrically insulating formulation suitable for high-density electronic modules.
Process Versatility – Compatible with multiple assembly methods such as screen printing, die-cutting, and automated placement.

应用:

Ideal for active cooling devices and other electronic applications demanding low thermal resistance and long-term reliability.

PAKCOOL® Thermally Conductive Phase Change Paste Specification

P/N	Appearance	Thermal Conductivity（W/m·K）	Phase transition temperatu（℃）	Viscosity （cP）	Thermal Impedance （K-in²/W）	silicone free	Density （g/cm³）	Continuous use Temperature	File
SPC-5430	White/Gray paste	＞3.0	44±2	200,000-400,000	≤0.01@20Psi	with silicone	2.80±0.10	-40 ~150℃	SPC-5430
PC-5440	White/Gray paste	＞4.0	50~60	Putty like	≤0.03@30Psi	silicone free	3.20±0.10	-40 ~150℃	PC-5440
PC-5460	Gray paste	＞6.0	50~60	Putty like	≤0.01@50Psi	silicone free	2.80±0.10	-40 ~150℃	PC-5460

PAKCOOL®PC-54xx series is offered in a 1Kg, 5Kg and 20Kg barrel or 330mL, 55mL tube or customizable according to customer requirements.

PAKCOOL® Thermally Conductive Phase Change Pads Specification

P/N	Color	Thermal Conductivity （W/m·K）	Thermal Impedance K-in²/W） @20psi, 0.5mm	Thickness (mm)	Density (g/cm³)	Phase Transition Temperature（℃）	Volume Resistivity（Ω·cm）	Continuous use Temperature	File
SPC-7630	Gray	3.0±0.1	0.34 (@20psi,0.5mm)	0.3-5.0	2.95±0.05	42-52	≥2.0×10¹³	-40 ~125℃	SPC-7630
PC-7630 silicone free	Gray	≥3.0	<0.15(@50Psi)	0.25-1.0	3.00±0.10	45~55	≥1.0×10¹⁴	-40 ~125℃	PC-7630
PC-7640 silicone free	Gray	≥4.0	<0.1(@50Psi)	0.25-1.0	3.25±0.10	45~55	≥1.0×10¹⁴	-40 ~125℃	PC-7640
PC-7660 silicone free	Gray	>6.0	<0.06(@40Psi)	0.25-1.0	2.75±0.10	50~60	≥2.0×10¹²	-40 ~125℃	PC-7660

PAKCOOL®PC-76xx Series Thermally Conductive Phase Change Pads are adhesive-free and can be cut to size according to customer requirements.

Application of Thermally Conductive Phase Change Materials

PAKCOOL® Thermal Conductive Phase Change Pad offers excellent stress-buffering capability

The hardness–temperature curve demonstrates that PAKCOOL® PC-7630 undergoes a distinct phase-change softening within its operating temperature range, where hardness drops sharply.
This behavior allows the material to soften automatically during device operation, conforming tightly to the interface and significantly reducing microscopic air gaps and contact thermal resistance.
Upon cooling, the material reverts to a solid state, maintaining dimensional stability and structural integrity without flowing or bleeding.
This reversible “softening on heating – solidifying on cooling” characteristic is the key distinction between phase-change pads and conventional elastomeric thermal pads

PAKCOOL® Thermally Conductive Phase Change Pad delivers ultra-low thermal resistance

The thermal resistance–pressure curve indicates that as pressure increases, the interface contact becomes more intimate, micro-voids are compressed, and thermal resistance decreases significantly.

PC-7630 maintains extremely low thermal resistance even under typical assembly pressures, demonstrating outstanding conformability and thermal performance.

This also highlights the product’s high compliance and excellent compression response, making it ideal for module clamping and pressure-mounted assembly processes.

根据客户需求，提供专业定制化服务。

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