PAKCOOL® PC-7660 combines thermal conductivity and phase change adaptability in one innovative interface material. Upon reaching its phase change temperature (50~60°C), the pad softens, becomes more adhesive, and efficiently fills micro gaps between heat sources and heat sinks—improving heat transfer while preventing leakage or pump-out.

Its self-tacky surface allows for easy placement without additional adhesives, minimizing assembly steps and mechanical stress. Compared with conventional pads, PC-7630 delivers lower thermal resistance and superior heat dissipation at the same pressure.

Key Features

• High Thermal Conductivity：6.0±0.1 W/m·K, 0.01 K·in²/W (@40 psi)
• Self-Adhesive：No additional adhesive required
• Softens Upon Phase Change：Enhances surface conformity
• Low Stress：Protects sensitive components
• No Flow or Leakage：Non-fluid after phase change
• Customizable Thickness：0.3–1.0 mm, flexible cutting options