PAKCOOL® TC-9165-T is a reworkable, one-part, addition-cure, heat-cured liquid thermal gap filler. In its uncured state, it is a liquid paste that can be applied using automated dispensing, screen printing, and other methods, providing excellent contact between the heat-generating surface and the heatsink. After high-temperature curing, it forms a soft gel with minimal stress and superior stability. This product overcomes the long curing times of moisture-cured products while maintaining the low stress and reworkability of non-curing thermal greases or pastes, facilitating maintenance and repair. It offers easier application, lower contact thermal resistance, and better performance for uneven and large gaps than traditional thermal pads. In addition, the product boasts high thermal conductivity, excellent insulation properties, and the ability to fill large gaps, making it suitable for various electronic devices requiring efficient thermal management.