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2025-10

PAKCOOL® Thermal Conductive Phase Change Paste PC-5430 — High Thermal Conductivity · Low Thermal Resistance · Stable and Reliable PCM Solution

PAKCOOL® PC-5430 is a high-performance thermally conductive phase change compound produced using Liquid Phase Mixing (LPM) technology. The liquid-to-liquid mixing process ensures excellent filler dispersion and stable performance, providing both high thermal conductivity and excellent interface wettability.

When heated to its phase change temperature (around 44°C / 65°C), the compound softens and flows to fill microscopic gaps between heat sources and heat sinks, achieving a thermal resistance as low as 0.01 K·in²/W. Unlike traditional greases, it does not suffer from pump-out, drying, or oil separation, ensuring long-term reliability.

Key Features

  • High Thermal Conductivity>3.5 W/m·K
  • Intelligent Phase Change AdaptabilityAutomatically softens and fills gaps for optimal contact
  • No Oil Separation or Dry-OutStable during long-term use
  • ReworkableEasy to remove and reapply during maintenance
  • Screen-Printing CompatibleSpecially formulated for screen printing